ANNEXSupplementary provisions
ANNEX In Annex IV to Directive 2011/65/EU, point 26 is replaced by the following: ‘26. Lead in the following applications that are used durably at a temperature below – 20 °C under normal operating and storage conditions: (a) solders on printed circuit boards; (b) termination coatings of electrical and electronic components and coatings of printed circuit boards; (c) solders for connecting wires and cables; (d) solders connecting transducers and sensors. Lead in solders of electrical connections to temperature measurement sensors in devices which are designed to be used periodically at temperatures below – 150 °C. These exemptions expire on 30 June 2021.’