ANNEX ISupplementary provisions
ANNEX I In Annex VII to Regulation (EU) No 833/2014, the following category is added: ‘Category VIII – Miscellaneous items X.A.VIII.001 Equipment for oil production or oil exploration as follows: a. Drill head integrated measurement equipment, including inertial navigation systems for measurement while drilling (MWD); b. Gas monitoring systems and detectors therefor, designed for continuous operation and detection of hydrogen sulphide; c. Equipment for seismological measurements, including reflection seismetics and seismic vibrators; d. Sediment echo sounders. X.A.VIII.002 Equipment, “electronic assemblies” and components, specially designed for quantum computers, quantum electronics, quantum sensors, quantum processing units, qubit circuits, qubit devices or quantum radar systems, including pockels cells. Note 1: quantum computers perform computations that harness the collective properties of quantum states, such as superposition, interference and entanglement. Note 2: Units, circuits and devices include but are not limited to superconducting circuits, Quantum annealing, Ion Trap, photonic interaction, silicon/spin, cold atoms. X.A.VIII.003 Microscopes, related equipment and detectors as follows: a. Scanning electron microscopes (SEM); b. Scanning auger microscopes; c. Transmission electron microscopes (TEM); d. Atomic force microscopes (AFM); e. Scanning force microscopes (SFM); f. Equipment and detectors, specially designed for use with the microscopes specified in X.A.VIII.003.a to X.A.VIII.0003.e, employing any of the following material analysis techniques: 1. X-ray photo spectroscopy (XPS); 2. Energy-dispersive X-ray spectroscopy (EDX, EDS) or 3. Electron spectroscopy for chemical analysis (ESCA). X.A.VIII.004 Collector equipment for metal ores in deep seabed. X.A.VIII.005 Manufacturing equipment and machine tools as follows: a. Additive manufacturing equipment for the “production” of metal parts; Note: X.A.VIII.005.a only applies to the following systems: 1. Powder-bed systems using selective laser melting (SLM), laser cusing, direct metal laser sintering (DMLS) or electron beam melting (EBM), or 2. Powder-fed systems using laser cladding, direct energy deposition or laser metal deposition. b. Additive manufacturing equipment for “energetic materials”, including equipment using ultrasonic extrusion; c. Vat photopolymerization (VVP) additive manufacturing equipment using stereo lithography (SLA) or digital light processing (DLP). X.A.VIII.006 Equipment for the “production” of printed electronics for organic light emitting diodes (OLED), organic field-effect transistors (OFET) or organic photovoltaic cells (OPVC). X.A.VIII.007 Equipment for the “production” of microelectromechanical systems (MEMS) using the mechanical properties of silicon, including sensors in chip format like pressure membranes, bending beams or micro adjustment devices. X.A.VIII.008 Equipment, specially designed for the production of E-Fuels (electrofuels and synthetic fuels) or ultra efficient solar cells (efficiency > 30 %). X.A.VIII.009 Equipment for Ultra-High-Vacuum (UHV) as follows: a. UHV pumps (sublimation, turbomolecular, diffusion, cryogenic, ion getter); b. UHV pressure gauges. Note: UHV means 100 nanoPascals (nPa) or lower. X.A.VIII.010 “Cryogenic refrigeration systems” designed to maintain temperatures below 1,1 K for 48 hrs or more and related cryogenic refrigeration equipment as follows: a. Pulse Tubes; b. Cryostats; c. Dewars; d. Gas Handling System (GHS); e. Compressors; f. Control Units. Note: “Cryogenic refrigeration systems” include but are not limited to Dilution Refrigeration, Adiabatic Demagnisation Refrigerators and Laser Cooling Systems. X.A.VIII.011 “Decapsulation” equipment for semiconductor devices. Note: “Decapsulation” is the removal of a cap, lid, or encapsulating material from a packaged integrated circuit by mechanical, thermal, or chemical means. X.A.VIII.012 High Quantum Efficiency (QE) photodetectors with a QE greater than 80 % in the wavelength range exceeding 400 nm but not exceeding 1 600 nm. X.AVIII.013 Numerical controlled machine tools, having one or more linear axis with a travel length greater than 8 000 mm. X.C.VIII.001 Metal powders and metal alloy powders, usable for any of the systems listed in X.A.VIII.005.a. X.C.VIII.002 Advanced materials as follows: a. Materials for cloaking or adaptive camouflage; b. Metamaterials, e.g. with a negative refractive index; c. Not used; d. High entropy alloys (HEA); e. Heusler compounds; f. Kitaev materials, including kitaev spin liquids. X.C.VIII.003 Conjugated polymers (conductive, semiconductive, electroluminescent) for printed or organic electronics. X.C.VIII.004 Energetic materials as follows and mixtures thereof: a. Ammonium picrate (CAS 131-74-8); b. Black powder; c. Hexanitrodiphenylamine (CAS 131-73-7); d. Difluoroamine(CAS 10405-27-3); e. Nitrostarch (CAS9056-38-6); f. Not used; g. Tetranitronaphthalene; h. Trinitroanisole; i. Trinitronaphthalene; j. Trinitroxylene; k. N-pyrrolidinone; 1-methyl-2-pyrrolidinone (CAS 872-50-4); l. Dioctylmaleate (CAS 142-16-5); m. Ethylhexylacrylate (CAS 103-11-7); n. Triethylaluminium (TEA) (CAS 97-93-8), trimethylaluminium (TMA) (CAS 75-24-1), and other pyrophoric metal alkyls and aryls of lithium, sodium, magnesium, zinc or boron; o. Nitrocellulose (CAS 9004-70-0); p. Nitroglycerin (or glyceroltrinitrate, trinitroglycerine) (NG) (CAS 55-63-0); q. 2,4,6-trinitrotoluene (TNT) (CAS 118-96-7); r. Ethylenediaminedinitrate (EDDN) (CAS 20829-66-7); s. Pentaerythritoltetranitrate (PETN) (CAS 78-11-5); t. Lead azide (CAS 13424-46-9), normal lead styphnate(CAS 15245-44-0) and basic lead styphnate (CAS 12403-82-6), and primary explosives or priming compositions containing azides or azide complexes; u. Not used; v. Not used; w. Diethyldiphenylurea (CAS 85-98-3); dimethyldiphenylurea(CAS 611-92-7); methylethyldiphenyl urea. x. N,N-diphenylurea (unsymmetrical diphenylurea) (CAS 603-54-3); y. Methyl-N,N-diphenylurea (methyl unsymmetrical diphenylurea)(CAS 13114-72-2); z. Ethyl-N,N-diphenylurea (ethyl unsymmetrical diphenylurea) (CAS 64544-71-4); aa. Not used; bb. 4-Nitrodiphenylamine (4-NDPA)(CAS 836-30-6); cc. 2,2-dinitropropanol (CAS 918-52-5); dd. Not used. X.D.VIII.001 Software, specially designed for the “development”, “production” or “use” of equipment specified in X.A.VIII.005 to X.A.VIII.0013. X.D.VIII.002 Software, specially designed for the “development”, “production” or “use” of equipment, “electronic assemblies” or components specified in X.A.VIII.002. X.D.VIII.003 Software for digital twins of additive manufacturing products or for the determination of the reliability of additive manufacturing products. X.E.VIII.001 Technology for the “development”, “production” or “use” of equipment specified in X.A.VIII.001 to X.A.VIII.0013. X.E.VIII.002 Technology for the “development”, “production” or “use” of materials specified in X.C.VIII.002 or X.C.VIII.003 X.E.VIII.003 Technology for digital twins of additive manufacturing products, for the determination of the reliability of additive manufacturing products or for software specified in X.D.VIII.003. X.E.VIII.004 Technology for the “development”, “production” or “use” of software specified in X.D.VIII.001 to X.D.VIII.002.’