Commission Delegated Directive (EU) 2019/172 of 16 November 2018 amending, for the purposes of adapting to scientific and technical progress, Annex III to Directive 2011/65/EU of the European Parliament and of the Council as regards an exemption for lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages (Text with EEA relevance.)

• CELEX: Delegated Directive (EU) 2019/172
• Articles: 5

Article 1

Annex III to Directive 2011/65/EU is amended as set out in the Annex to this Directive.

Article 2

1.   Member States shall adopt and publish, by 29 February 2020 at the latest, the laws, regulations and administrative provisions necessary to comply with this Directive. They shall forthwith communicate to the Commission the text of those provisions.

They shall apply those provisions from 1 March 2020.

When Member States adopt those provisions, they shall contain a reference to this Directive or be accompanied by such a reference on the occasion of their official publication. Member States shall determine how such reference is to be made.

2.   Member States shall communicate to the Commission the text of the main provisions of national law which they adopt in the field covered by this Directive.

Article 3

This Directive shall enter into force on the twentieth day following that of its publication in the Official Journal of the European Union .

Article 4

This Directive is addressed to the Member States.

Schedules & Appendices

ANNEX

ANNEX

In Annex III, entry 15 is replaced by the following:

‘15

Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages

Applies to categories 8, 9 and 11 and expires on:

—

21 July 2021 for categories 8 and 9 other than in vitro diagnostic medical devices and industrial monitoring and control instruments;

—

21 July 2023 for category 8 in vitro diagnostic medical devices;

—

21 July 2024 for category 9 industrial monitoring and control instruments, and for category 11.

15(a)

Lead in solders to complete a viable electrical connection between the semiconductor die and carrier within integrated circuit flip chip packages where at least one of the following criteria applies:

—

a semiconductor technology node of 90 nm or larger;

—

a single die of 300 mm 2 or larger in any semiconductor technology node;

—

stacked die packages with die of 300 mm 2 or larger, or silicon interposers of 300 mm 2 or larger.

Applies to categories 1 to 7 and 10 and expires on 21 July 2021.’