Commission Delegated Directive (EU) 2025/1802 of 8 September 2025 amending Directive 2011/65/EU of the European Parliament and of the Council as regards an exemption for lead in high melting temperature solders

• CELEX: Delegated Directive (EU) 2025/1802
• Articles: 5

Article 1

Annex III to Directive 2011/65/EU is amended in accordance with the Annex to this Directive.

Article 2

1.   Member States shall adopt and publish, by 30 June 2026 at the latest, the laws, regulations and administrative provisions necessary to comply with this Directive. They shall forthwith communicate to the Commission the text of those provisions.

They shall apply those provisions from 1 July 2026.

When Member States adopt those provisions, they shall contain a reference to this Directive or be accompanied by such a reference on the occasion of their official publication. Member States shall determine how such reference is to be made.

2.   Member States shall communicate to the Commission the text of the main provisions of national law which they adopt in the field covered by this Directive.

Article 3

This Directive shall enter into force on the twentieth day following that of its publication in the Official Journal of the European Union .

Article 4

This Directive is addressed to the Member States.

Schedules & Appendices

ANNEX

ANNEX

In Annex III to Directive 2011/65/EU, point 7(a) is replaced by the following:

‘7(a)

Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)

Applies to all categories (except applications covered by point 24 of this Annex) and expires on 30 June 2027.

7(a)-I

Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)

for internal interconnections for attaching die, or other components along with a die in semiconductor assembly with steady state or transient/impulse currents of 0,1 A or greater or blocking voltages beyond 10 V, or die edge sizes larger than 0,3 mm × 0,3 mm

Applies to all categories (except applications covered by point 24 of this Annex) and expires on 31 December 2027.

7(a)-II

Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)

for integral (meaning internal and external) connections of die attach in electrical and electronic components, if all the following conditions are met:

—

the thermal conductivity of the cured/sintered die-attach material is > 35 W/(m × K),

—

the electrical conductivity of the cured/sintered die-attach material is > 4,7 MS/m,

—

solidus melting temperature is higher than 260 °C

Applies to all categories (except applications covered by point 24 of this Annex) and expires on 31 December 2027.

7(a)-III

Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)

in first level solder joints (internal or integral connections – meaning internal and external) for manufacturing components so that subsequent mounting of electronic components onto subassemblies (i.e. modules, sub-circuit boards, substrates, or point-to-point soldering) with a secondary solder does not reflow the first level solder. This sub-entry excludes die attach applications and hermetic sealings

Applies to all categories (except applications covered by point 24 of this Annex) and expires on 31 December 2027.

7(a)-IV

Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)

in second level solder joints for the attachment of components to printed circuit board or lead frames:

(1)

in solder balls for the attachment of ceramic ball-grid-array (BGA);

(2)

in high temperature plastic overmouldings (> 220 °C)

Applies to all categories (except applications covered by point 24 of this Annex) and expires on 31 December 2027.

7(a)-V

Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)

as a hermetic sealing material between:

(1)

a ceramic package or plug and a metal case;

(2)

component terminations and an internal sub-part

Applies to all categories (except applications covered by point 24 of this Annex) and expires on 31 December 2027.

7(a)-VI

Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)

for establishing electrical connections between lamp components in incandescent reflector lamps for infrared heating, high intensity discharge lamps, or oven lamps

Applies to all categories (except applications covered by point 24 of this Annex) and expires on 31 December 2027.

7(a)-VII

Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)

for audio transducers where the peak operating temperature exceeds 200 °C

Applies to all categories (except applications covered by point 24 of this Annex) and expires on 31 December 2027.’