In paragraph 5, “the 2020 Regulations” means the Hazardous Substances and Packaging (Legislative Functions and Amendment) (EU Exit) Regulations 2020.
Table of exempted applications
OJ No L 326, 19.12.1969, p.36, as last amended by Council Directive 2006/96/EC (OJ No L 363, 20.12.2006, p.81).
EUR 2016/1628.
Annex 3, 2(a)(3)
Lead in high melting temperature type solders, i.e. lead-based alloys containing 85% by weight or more lead.
This entry does not apply to applications covered by entry 42.
Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound.
This entry does not apply to applications covered by entry 49.
Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher.
This entry does not apply to applications covered by entry 21 or 23.
Cadmium and its compounds in electrical contacts used in:
— circuit breakers,
— thermal sensing controls,
— thermal motor protectors (excluding hermetic thermal motor protectors),
— AC switches rated at:
6 A and more at 250 V AC and more, or
12 A and more at 125 V AC and more,
— DC switches rated at 20 A and more at 18 V DC and more, and
— switches for use at voltage supply frequency ≥ 200 Hz.
Lead in solders to complete a viable electrical connection between the semiconductor die and carrier within integrated circuit flip chip packages where at least one of the following criteria applies:
— a semiconductor technology node of 90 nm or larger;
— a single die of 300 mm² or larger in any semi-conductor technology node;
— stacked die packages with die of 300 mm² or larger, or silicon interposers of 300mm 2 or larger.
Lead as activator in the fluorescent powder of discharge lamps containing phosphors such as BSP (BaSi 2 O 5 :Pb) when used in medical phototherapy equipment.
This entry does not apply to applications covered by entry 88.
Lead in bearings and bushes of diesel or gaseous fuel powered internal combustion engines applied in non-road professional use equipment:
— with engine total displacement ≥ 15 litres; or
— with engine total displacement < 15 litres and the engine is designed to operate in applications where the time between signal to start and full load is required to be less than 10 seconds; or regular maintenance is typically performed in a harsh and dirty outdoor environment, such as mining, construction, and agriculture applications.
This entry does not apply to applications covered by entry 18.
Bis(2-ethylhexyl) phthalate in rubber components in engine systems, designed for use in equipment that is not intended solely for consumer use and provided that no plasticised material comes into contact with human mucous membranes or into prolonged contact with human skin.
This entry applies where the concentration value of bis(2-ethylhexyl) phthalate does not exceed:
30 % by weight of the rubber for:
gasket coatings;
solid-rubber gaskets; or
rubber components included in assemblies of at least three components using electrical, mechanical or hydraulic energy to do work, and attached to the engine.
10% by weight of the rubber for rubber-containing components not referred to in point (a).
For the purposes of this entry, ‘prolonged contact with human skin’ means continuous contact of more than 10 minutes duration or intermittent contact over a period of 30 minutes, per day.
Lead in electromagnetic radiation amplification devices:
micro-channel plate and capillary plate.
Lead in the following applications that are used durably at a temperature below –20 °C under normal operating and storage conditions:
solders on printed circuit boards;
termination coatings of electrical and electronic components and coatings of printed circuit boards;
solders for connecting wires and cables;
solders connecting transducers and sensors.
Lead in solders of electrical connections to temperature measurement sensors in devices which are designed to be used periodically at temperatures below –150 °C.
Lead in:
— solders,
— termination coatings of electrical and electronic components and printed circuit boards,
— connections of electrical wires, shields and enclosed connectors,
which are used in:
magnetic fields within the sphere of 1 m radius around the isocentre of the magnet in medical magnetic resonance imaging equipment, including patient monitors designed to be used within this sphere, or
magnetic fields within 1 m distance from the external surfaces of cyclotron magnets, magnets for beam transport and beam direction control applied for particle therapy.
Lead in platinized platinum electrodes used for conductivity measurements where at least one of the following conditions applies:
wide-range measurements with a conductivity range covering more than 1 order of magnitude (e.g. range between 0.1 mS/m and 5 mS/m) in laboratory applications for unknown concentrations;
measurements of solutions where an accuracy of +/– 1 % of the sample range and where high corrosion resistance of the electrode are required for any of the following:
solutions with an acidity < pH 1;
solutions with an alkalinity > pH 13;
corrosive solutions containing halogen gas;
measurements of conductivities above 100 mS/m that must be performed with portable instruments.
Lead in micro-channel plates (MCPs) used in equipment where at least one of the following properties is present:
a compact size of the detector for electrons or ions, where the space for the detector is limited to a maximum of 3 mm/MCP (detector thickness + space for installation of the MCP), a maximum of 6 mm in total, and an alternative design yielding more space for the detector is scientifically and technically impracticable;
a two-dimensional spatial resolution for detecting electrons or ions, where at least one of the following applies:
a response time shorter than 25 ns;
a sample detection area larger than 149 mm² ;
a multiplication factor larger than 1.3 × 10³ .
a response time shorter than 5 ns for detecting electrons or ions;
a sample detection area larger than 314 mm² for detecting electrons or ions;
a multiplication factor larger than 4.0 × 10 7 .
31st March 2027
Table of exemptions for spare parts for EEE with no expiry date