Commission Delegated Directive (EU) 2020/363 of 17 December 2019 amending Annex II to Directive 2000/53/EC of the European Parliament and of the Council on end-of-life vehicles as regards certain exemptions for lead and lead compounds in components (Text with EEA relevance)

• CELEX: Delegated Directive (EU) 2020/363
• Articles: 5

Article 1

Annex II to Directive 2000/53/EC is amended as set out in the Annex to this Directive.

Article 2

1.   Member States shall adopt and publish by 5 April 2020 at the latest, the laws, regulations and administrative provisions necessary to comply with this Directive. They shall forthwith communicate to the Commission the text of those provisions.

When Member States adopt those provisions, they shall contain a reference to this Directive or be accompanied by such a reference on the occasion of their official publication. Member States shall determine how such reference is to be made.

2.   Member States shall communicate to the Commission the text of the main provisions of national law, which they adopt in the field covered by this Directive.

Article 3

This Directive shall enter into force on the day following that of its publication in the Official Journal of the European Union .

Article 4

This Directive is addressed to the Member States.

Schedules & Appendices

ANNEX

ANNEX

Annex II to Directive 2000/53/EC is amended as follows:

(1)

entry 8(e) is replaced by the following:

‘8(e). Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)

( 2 )

X’

(2)

entry 8(f)(b) is replaced by the following:

‘8(f)(b). Lead in compliant pin connector systems other than the mating area of vehicle harness connectors

Vehicles type-approved before 1 January 2024 and spare parts for these vehicles

X’

(3)

entry 8(g) is replaced by the following:

‘8(g)(i). Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages

Vehicles type approved before 1 October 2022 and spare parts for these vehicles

X

8(g)(ii). Lead in solders to complete a viable electrical connection between the semiconductor die and the carrier within integrated circuit flip chip packages where that electrical connection consists of any of the following:

(i)

a semiconductor technology node of 90 nm or larger;

(ii)

a single die of 300 mm 2 or larger in any semiconductor technology node;

(iii)

stacked die packages with dies of 300 mm 2 or larger, or silicon interposers of 300 mm 2 or larger.

( 2 )

Valid for vehicles type-approved from 1 October 2022 and spare parts for these vehicles

X’

(4)

the following entry 8(k) is inserted:

‘8(k). Soldering of heating applications with 0,5 A or more of heat current per related solder joint to single panes of laminated glazings not exceeding wall thickness of 2,1 mm. This exemption does not cover soldering to contacts embedded in the intermediate polymer

Vehicles type approved before 1 January 2024 and spare parts for these vehicles

X( 4 )’